SINOMER® PM839: A Low-Temperature Rapid Curing Agent for Two-Component Epoxy Systems

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SINOMER® PM839: A Low-Temperature Rapid Curing Agent for Two-Component Epoxy Systems

Introduction

SINOMER® PM839 is a thiol-terminated polymer curing agent (CAS 72244-98-5) engineered for fast, energy-efficient curing in epoxy resin systems. As a sustainable alternative to traditional agents like Capcure 3-800, it delivers rapid crosslinking with minimal environmental impact, making it ideal for electronics, coatings, and photovoltaic (PV) silicon rod cutting adhesives,Can replace Capcure 3-800;GABEPRO GPM-800;Polythiol QE-340M.


Key Benefits

Rapid Curing: Achieves full cure at 25–40°C within 1–2 hours, slashing production downtime.

Low Shrinkage (<1%): Reduces stress-induced defects in delicate applications like PV wafer processing.

High Adhesion: Bonds strongly to metals, ceramics, and silicon (tested per ASTM D4541).

Eco-Friendly: Halogen-free (Cl ≤800 ppm), RoHS/REACH compliant, and low-VOC (<1.2%).


Applications

  • Electronics Encapsulation

    • Potting compounds for circuit boards, ensuring moisture and thermal resistance.

      Example: Cures at 25°C in 2–4 hours, enabling high-throughput manufacturing.

  • Anticorrosive Coatings

    • Marine/industrial coatings with enhanced chemical resistance.

  • Photovoltaic Silicon Rod Cutting Adhesives 

    • Precision bonding for diamond wire sawing of silicon wafers.

    • Performance Highlights:

      • Reduces wafer breakage to <0.5% (vs. 1.5–3% industry average).

      • Resists glycol-based coolants and 120°C cutting heat.

  • Jewelry & Craftwork Bonding

    • Clear, non-yellowing bonds for delicate materials.



Technical Specifications

Property

Value

Appearance

Colorless transparent liquid

Viscosity (25°C)

12,000–14,000 mPa·s

Mercapto Equivalent

≥3.0

Storage

Stable under nitrogen, 12-month shelf life



Case Study: PV Wafer Manufacturer Efficiency Boost

  • Challenge: 2.8% wafer breakage due to adhesive stress.

  • Solution: Adopted SINOMER® PM839-based adhesive.

  • Results:

    • Breakage reduced to 0.4%; annual savings: $150,000.

    • 20% faster production via 1–2 hour curing at 30°C.


Why Choose SINOMER® PM839?

  • Cost Efficiency: 30% lower energy use vs. high-temperature curing.

  • Performance: Exceeds ASTM/ISO benchmarks for hardness (≥3H) and thermal stability.

  • Sustainability: Aligns with global green manufacturing standards.



Get Started Today!

Optimize your epoxy or PV adhesive process with SINOMER® PM839.
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